This inventor holds 5 USPTO granted patents. Top assignees: Infineon Technologies Ag, Qimonda Ag. Active years: 2005-2013.
Company Filing History:
Years Active: 2005-2013
Title: Steffen Kroehnert: Innovator in Semiconductor Technology
Introduction
Steffen Kroehnert is a prominent inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His innovative work has advanced the design and functionality of semiconductor devices.
Latest Patents
Kroehnert's latest patents include a semiconductor device with a chip mounted on a substrate. This invention features a semiconductor chip that is securely contacted to the substrate's contact elements. The encapsulation of the chip includes the substrate, a cover, and a pocket that stabilizes the chip's position. Notably, the cover is made from the same material as the substrate. Another significant patent involves packaging systems and methods for semiconductor devices. This system comprises a first plate with a specific coefficient of thermal expansion (CTE) and an integrated circuit that can be mounted to it. A second plate, which has a similar CTE, is coupleable over the first plate, ensuring compatibility and efficiency in the packaging process.
Career Highlights
Throughout his career, Steffen Kroehnert has worked with leading companies in the semiconductor industry, including Infineon Technologies AG and Qimonda AG. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in technology.
Collaborations
Kroehnert has collaborated with notable professionals in the field, including Martin Reiss and Juergen Grafe. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Steffen Kroehnert's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of semiconductor devices and packaging systems.

