The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Jun. 15, 2004
Martin Reiss, Ottendorf-Okrilla OT Medingen, DE;
Steffen Kroehnert, Dresden, DE;
Martin Reiss, Ottendorf-Okrilla OT Medingen, DE;
Steffen Kroehnert, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The invention relates to a substrate-based IC package that includes a substrate on which a chip is mounted with a die attach material. The substrate is provided with a solder resist and has, on the side opposite the chip, conductor tracks provided with soldering globules. The conductor tracks are electrically coupled to the chip via wire jumpers, which extend through a bond channel which is filled with a mold compound. The chip and the substrate are encapsulated with a mold cap on the chip side. The substrate is provided with spacers for supporting a printing template for applying the die attach material. A strip of a solder resist that surrounds at least the bond channel gaplessly with essentially the same width is provided as the spacer.