The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2008
Filed:
Jun. 10, 2003
Juergen Zacherl, Donaustauf, DE;
Stephan Blaszczak, Freyburg, DE;
Martin Reiss, Dresden, DE;
Sylke Ludewig, Dresden, DE;
Juergen Zacherl, Donaustauf, DE;
Stephan Blaszczak, Freyburg, DE;
Martin Reiss, Dresden, DE;
Sylke Ludewig, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The invention relates to a packaging for semiconductor components such as FBGA packages in BOC technology or the like, wherein at least the back and the lateral edges of a chip () mounted on a substrate are enclosed by a mold coating (), the casting compound used for the mold coating () being linked with the substrate and forming an integrated whole therewith. The invention further relates to a method for producing such a packaging for semiconductor components. The aim of the invention is to provide a packaging for semiconductor components which is characterized by reduced thermomechanical stress and at the same time a substantially improved adhesion of the mold coating to the substrate, thereby allowing for a higher package load. According to the invention, this aim is achieved in that the substrate (), at least in some areas, has a spongy structure () that is provided with pore-type openings and that extends from the surface to the depths of the structure so that the molding material penetrates the substrate () by capillary attraction.