The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2007
Filed:
Jul. 26, 2005
Martin Reiss, Dresden, DE;
Kerstin Nocke, Dresden, DE;
Martin Reiss, Dresden, DE;
Kerstin Nocke, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A semiconductor component comprises a substrate that includes wiring on a first surface. A chip is mounted on a second surface of the substrate by a die attach, the second surface opposite the first surface. A bond channel in the center of the substrate allows for electrical connection of contact pads on the wiring with bond pads arranged in a center row on the chip by wire loops. A housing made of a mold compound surrounds a backside of the chip and parts of the substrate adjacent to the wiring. The semiconductor component further comprises a rigid prepreg layer covering, as well as the wiring of the substrate and the prepreg layer being provided with openings. Each opening is arranged in such a manner that the contact pads are accessible, and solder balls are mounted on each of the contact pads through the openings.