The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Jun. 21, 2007
Applicants:
Octavio Trovarelli, Dresden, DE;
Martin Reiss, Dresden, DE;
Bernd Zimmermann, Dresden, DE;
Inventors:
Assignee:
Qimonda AG, München, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a method of making an electronic component, an electrically conductive redistribution line is formed on a surface of a semiconductor chip. The redistribution line includes a solder pad. A covering material is formed over the solder pad and an uncovered portion of the redistribution line is passivated. The covering material prevents passivation of the solder pad. Solder is then formed over the solder pad such that the uncovered portion of the redistribution line has solder resist properties due to the passivating.