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For the Inventor, By the Inventor

Lucas, TX, United States of America

Mark Allen Gerber

USPTO Granted Patents = 22 

Average Co-Inventor Count = 1.5

ph-index = 9

Forward Citations = 373(Granted Patents)


Location History:

  • Plano, TX (US) (2006 - 2013)
  • Lucas, TX (US) (2008 - 2019)

Company Filing History:

goldMedal22 out of 29,232 
 
Texas Instruments Corporation
 patents

Years Active: 2006-2019

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22 patents (USPTO):Explore Patents
1. 10510643 - Semiconductor package with lead frame and recessed solder terminals (2019-12-17),
2. 9978667 - Semiconductor package with lead frame and recessed solder terminals (2018-05-22),
3. 9929072 - Packaged semiconductor devices (2018-03-27),
4. 9257341 - Method and structure of packaging semiconductor devices (2016-02-09),
5. 9253910 - Circuit assembly (2016-02-02),
6. 9129955 - Semiconductor flip-chip system having oblong connectors and reduced trace pitches (2015-09-08),
7. 8574967 - Method for fabricating array-molded package-on-package (2013-11-05),
8. 8430969 - Method for exposing and cleaning insulating coats from metal contact surfaces (2013-04-30),
9. 8304285 - Array-molded package-on-package having redistribution lines (2012-11-06),
10. 8133761 - Packaged system of semiconductor chips having a semiconductor interposer (2012-03-13),
11. 7944034 - Array molded package-on-package having redistribution lines (2011-05-17),
12. 7790509 - Method for fine-pitch, low stress flip-chip interconnect (2010-09-07),
13. 7776653 - Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices (2010-08-17),
14. 7675152 - Package-on-package semiconductor assembly (2010-03-09),
15. 7655552 - Double density method for wirebond interconnect (2010-02-02),

Title: The Innovative Contributions of Mark Allen Gerber in Semiconductor Technology

Introduction: Mark Allen Gerber, based in Lucas, Texas, is an accomplished inventor with an impressive portfolio of 22 patents. His work, particularly in semiconductor technology, has made significant impacts in the industry, demonstrating both innovation and technical expertise.

Latest Patents: Gerber's recent patents focus on advanced semiconductor packaging. Notably, one of his latest inventions is a semiconductor package featuring a lead frame with recessed solder terminals. This semiconductor device comprises a leadframe that includes an assembly pad positioned in a first horizontal plane, where a semiconductor chip is attached. Additionally, the design features multiple leads in a second horizontal plane, which are offset from the first plane towards the attached chip. These leads are equipped with bonding wires on one surface and a fourth surface that interacts with a package encapsulating the leadframe, chip, and wires. The innovation includes recessed holes in the package, allowing for solder attachment that enhances the device's functionality and performance.

Career Highlights: Mark Allen Gerber has had a distinguished career at Texas Instruments Corporation, where he applies his expertise in semiconductor technologies. His commitment to innovation and development has not only resulted in numerous patents but also contributed to the advancements in the semiconductor field.

Collaborations: Throughout his career, Gerber has collaborated with notable colleagues, including Kurt Peter Wachtler and Abram M. Castro. These partnerships reflect a team-oriented approach to fostering innovation and developing cutting-edge technologies.

Conclusion: Mark Allen Gerber exemplifies the spirit of innovation within the semiconductor industry. With 22 patents to his name and valuable contributions at Texas Instruments Corporation, he continues to drive advancements in technology that shape the future of electronic devices. His collaborative efforts with peers only serve to enhance the impact of his innovative work.

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