The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2010

Filed:

Sep. 01, 2005
Applicants:

Mark Allen Gerber, Plano, TX (US);

Shawn Martin O'conner, McKinney, TX (US);

Inventors:

Mark Allen Gerber, Plano, TX (US);

Shawn Martin O'Conner, McKinney, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed are methods and devices for providing improved semiconductor packages and POP IC assemblies using the improved packages with reduced warping. According to disclosed embodiments of the inventions, a packaged semiconductor device for use in a POP assembly includes an encapsulated region generally defined by the substrate surface. The encapsulant is provided with contact apertures permitting external communication with contacts on the substrate and coupled to an encapsulated chip. Preferred embodiments of the invention are described in which the contact aperture sidewalls are angled within the range of approximately 10-30 degrees or more from vertical and in which the contact aperture is provided a gas release channel to permit gas to escape during reflow.


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