The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Dec. 22, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Mark A. Gerber, Lucas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 23/482 (2006.01); H01L 23/495 (2006.01); H01L 23/532 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/16 (2013.01); H01L 23/4824 (2013.01); H01L 23/49534 (2013.01); H01L 23/53209 (2013.01); H01L 24/18 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor device has a semiconductor chip having a first surface with metallized terminals and a parallel second surface. A frame of insulating material adheres to at the sidewalls of the chip. The frame has a first surface planar with the first chip surface and a parallel second surface planar with the second chip surface. The first frame surface includes one or more embedded metallic fiducials extending from the first surface to the insulating material. At least one film of sputtered metal extends from the terminals across the surface of the polymeric layer to the fiducials. The film is patterned to form extended contact pads over the frame and rerouting traces between the chip terminals and the extended contact pads. The film adheres to the surfaces.


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