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For the Inventor, By the Inventor

Cupertino, CA, United States of America

Maniam B Alagaratnam

This inventor holds 23 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Lsi Logic Corporation. Active years: 1995-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Maniam B Alagaratnam. Retrieved from https://idiyas.com/inventor/maniam-b-alagaratnam

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 767(Granted Patents)


Company Filing History:

goldMedal23 out of 3,715 
 
Lsi Logic Corporation
 patents

Years Active: 1995-2006

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Areas of Expertise:
Thermal Communication
Multi Chip Module
Electrolytic Contact Pads
Integrated Circuit Package
Dual Chip Package
Flip Chip
High Density Routing
Test Fixture
Anodized Aluminum
Overmolded Package
Ball Grid Array
Heat Sink Attachment
23 patents (USPTO):Explore Patents
1. 7119432 - Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package (2006-10-10),
2. 7041516 - Multi chip module assembly (2006-05-09),
3. 6777314 - Method of forming electrolytic contact pads including layers of copper, nickel, and gold (2004-08-17),
4. 6618938 - Interposer for semiconductor package assembly (2003-09-16),
5. 6608376 - Integrated circuit package substrate with high density routing mechanism (2003-08-19),
6. 6586825 - Dual chip in package with a wire bonded die mounted to a substrate (2003-07-01),
7. 6433565 - Test fixture for flip chip ball grid array circuits (2002-08-13),
8. 6429534 - Interposer tape for semiconductor package (2002-08-06),
9. 6335491 - Interposer for semiconductor package assembly (2002-01-01),
10. 6297550 - Bondable anodized aluminum heatspreader for semiconductor packages (2001-10-02),
11. 6225695 - Grooved semiconductor die for flip-chip heat sink attachment (2001-05-01),
12. 6110815 - Electroplating fixture for high density substrates (2000-08-29),
13. 6081997 - System and method for packaging an integrated circuit using encapsulant (2000-07-04),
14. 6057594 - High power dissipating tape ball grid array package (2000-05-02),
15. 5927505 - Overmolded package body on a substrate (1999-07-27),

Title: The Innovative Journey of Maniam B Alagaratnam

Introduction: Maniam B Alagaratnam is a renowned inventor based in Cupertino, CA, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Maniam B Alagaratnam holds several patents in the areas of artificial intelligence, machine learning, and robotics, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Maniam B Alagaratnam has worked with leading tech companies, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations: Throughout his career, Maniam B Alagaratnam has collaborated with top researchers, engineers, and scientists, fostering a culture of innovation and creativity in the projects he undertakes.

Conclusion: Maniam B Alagaratnam's passion for innovation and his relentless pursuit of technological excellence continue to inspire the next generation of inventors and researchers in the ever-evolving tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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