The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
Jan. 06, 2000
Applicant:
Inventors:
Qwai H. Low, Cupertino, CA (US);
Chok J. Chia, Cupertino, CA (US);
Maniam Alagaratnam, Cupertino, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ; H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ; H01L 2/3495 ;
Abstract
Provided is an interposer tape which provides electrical communication between a die and a packaging substrate. The dimensions of the interposer tape may vary to accommodate a variety of die sizes for the same packaging substrate. The interposer tape includes an array of traces. A first set of wire bonds is formed between the array of traces and the die. A second set of wire bonds is formed between the array of traces and the packaging substrate.