The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2001
Filed:
Apr. 01, 1998
Chok J. Chia, Campbell, CA (US);
Patrick Variot, San Jose, CA (US);
Maniam Alagaratnam, Cupertino, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A semiconductor package (,) includes a bondable aluminum heatspreader (,) made from anodized aluminum, thereby forming an anodization layer (,) on the surface of the heatspreader. Portions of the anodization layer are removed, e.g., by grinding, in order to provide an attachment area (,) to which a wire (,) or beam may be bonded in order to electrically connect the heatspreader to a desired voltage potential, such as a ground potential or a positive or negative potential. The heatspreader is thermally bonded to a semiconductor die (,) housed within the package. The anodized aluminum heatspreader thus not only removes and dissipates heat from the semiconductor die, but also functions as a voltage or ground plane within the semiconductor package.