System and method for packaging an integrated circuit using encapsulant

Abstract

A system and method are presented for forming a grid array device package around an integrated circuit. The integrated circuit includes multiple I/O pads on an underside surface, and an upper surface of a substrate includes a corresponding set of bonding pads. The substrate also has an opening (i.e., a hole) extending therethrough and preferably substantially in the center of the set of bonding pads. Solder bumps formed upon the I/O pads of the integrated circuit are placed in direct contact with corresponding members of the set of bonding pads, then heated until they flow in a C4 connection method. Following C4 connection of the I/O and bonding pads, the substrate and the attached integrated circuit are positioned within a mold cavity formed between two mold sections, and a liquid encapsulant material is injected through the opening of the substrate such that the encapsulant fills the mold cavity. The coupled I/O and bonding pads are enveloped by the liquid encapsulant. The liquid encapsulant is preferably a C4 underfill material. By injecting the liquid encapsulant under pressure, the amount of time required to dispense the liquid encapsulant is reduced as well as the number of voids present in the liquid encapsulant. Following at least partial curing of the encapsulant, the mold sections are separated, and the packaged semiconductor device is removed. When fully cured and hardened, the encapsulant adheres to the adjacent surfaces of the integrated circuit and the substrate, essentially interlocking the surfaces.