This inventor holds 5 USPTO granted patents. Top assignee: Lsi Logic Corporation. Active years: 1999-2003.
Company Filing History:
Years Active: 1999-2003
Title: Innovations by Seng Sooi Lim
Introduction
Seng Sooi Lim is a notable inventor based in San Jose, CA (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 5 patents. His work focuses on improving the efficiency and reliability of electronic components.
Latest Patents
One of his latest patents is for a molded integrated circuit package. This invention involves a mold designed for encapsulating an integrated circuit, where an encapsulant is injected during the packaging process. The mold features a shaped member that contacts the surface of the integrated circuit, preventing the encapsulant from adhering to it. This design allows the surface of the integrated circuit to remain exposed, enhancing heat conduction away from the component.
Another significant patent is for an overmold integrated circuit package. This manufacturing process aims to reduce or eliminate voids in the molding compound between a die and its substrate. The process includes forming electrically conductive vias through the substrate and attaching the integrated circuit die while maintaining a gap. This innovative approach ensures that trapped air flows into the vias, preventing void formation in the molding compound.
Career Highlights
Seng Sooi Lim has worked at LSI Logic Corporation, where he has been instrumental in developing advanced packaging solutions for integrated circuits. His expertise in this area has led to numerous innovations that enhance the performance of electronic devices.
Collaborations
Throughout his career, Seng has collaborated with talented individuals such as Chok J Chia and Wee Keong Liew. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Seng Sooi Lim's contributions to integrated circuit packaging demonstrate his commitment to innovation in the electronics industry. His patents reflect a deep understanding of the challenges in this field and provide solutions that enhance device performance.