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For the Inventor, By the Inventor

Tokyo, Japan

Maki Yonetsu

This inventor holds 30 USPTO granted patents and 12 published patent applications, primarily in Bonded Body Technology. Top assignees: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.. Active years: 2001-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Maki Yonetsu. Retrieved from https://idiyas.com/inventor/maki-yonetsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 30 

% Patents Active = 83.3

Average Co-Inventor Count = 4.7

ph-index = 6

Forward Citations = 280(Granted Patents)


Location History:

  • Yokohama, JP (2001 - 2003)
  • Yokahama, JP (2006)
  • Kawasaki, JP (2006)
  • Kanagawa-ken, JP (2002 - 2007)
  • Tokyo, JP (2010 - 2022)
  • Mitaka, JP (2010 - 2024)

Company Filing History:

goldMedal30 out of 53,286 
 
Kabushiki Kaisha Toshiba
 patents
silverMedal6 out of 266 
 
Toshiba Materials Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2001-2025

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Areas of Expertise:
Bonded Body
Semiconductor Device
Ceramic Circuit Board
Fuel Cell
Antenna Device
Core-Shell Magnetic Material
High-Frequency Magnetic Material
Nanoparticle Composite Material
Vapor Separator
Electrode Catalyst Material
Photosensitized Solar Cell
30 patents (USPTO):Explore Patents
1. 12431406 - Bonded body, circuit board, semiconductor device, and method for manufacturing bonded body (2025-09-30),
2. 12347744 - Bonded body including titanium alloy at bonding boundary (2025-07-01),
3. 12343820 - Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body (2025-07-01),
4. 12308301 - Structure and bonded body (2025-05-20),
5. 12160959 - Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board (2024-12-03),
6. 12115603 - Bonded body, ceramic copper circuit substrate, and semiconductor device (2024-10-15),
7. 11948900 - Bonded body, circuit board, and semiconductor device (2024-04-02),
8. 11729907 - Structure and circuit board (2023-08-15),
9. 11355416 - Structure and joined composite (2022-06-07),
10. 10184674 - Vapor separator and dehumidifier using the same (2019-01-22),
11. 10173168 - Vapor separator and dehumidifier using the same (2019-01-08),
12. 8988301 - Core-shell magnetic material, method for producing core-shell magnetic material, device, and antenna device (2015-03-24),
13. 8986839 - Metal-containing particle aggregate, metal-containing particle composite member, and method of manufacturing the aggregate and the composite member (2015-03-24),
14. 8580462 - Electrode catalyst material comprising carbon nano-fibers having catalyst particles on the surface and in the insides of the interior area and a fuel cell having the electrode catalyst material (2013-11-12),
15. 8508423 - Antenna device (2013-08-13),

Title: The Innovative Mind of Maki Yonetsu

Introduction: Maki Yonetsu, a pioneering inventor hailing from Tokyo, Japan, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Maki Yonetsu holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Maki Yonetsu has worked with leading research institutions and tech companies, consistently pushing the boundaries of what is possible in the realm of technological advancement.

Collaborations: Throughout his career, Maki Yonetsu has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of innovation and creativity in all his projects.

Conclusion: Maki Yonetsu's relentless pursuit of innovation and his passion for creating technologies that shape the future make him a true visionary in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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