The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

May. 27, 2022
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Materials Co., Ltd., Yokohama, JP;

Inventors:

Maki Yonetsu, Mitaka, JP;

Seiichi Suenaga, Yokohama, JP;

Sachiko Fujisawa, Kawasaki, JP;

Takashi Sano, Fujisawa, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 35/30 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 18/00 (2006.01); C04B 37/02 (2006.01); C22C 30/02 (2006.01); H05K 3/38 (2006.01); B23K 101/42 (2006.01); B23K 103/00 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3006 (2013.01); B23K 1/0016 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); B32B 18/00 (2013.01); C04B 37/023 (2013.01); C22C 30/02 (2013.01); H05K 3/388 (2013.01); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); B23K 2103/52 (2018.08); C04B 2237/125 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); H05K 2203/04 (2013.01);
Abstract

According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate and a metal plate, the brazing material has an endothermic peak within a range of not less than 550° C. and not more than 700° C. in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550° C. and not more than 650° C. in the heating process.


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