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For the Inventor, By the Inventor

Yokohama, Japan

Toshiba Materials Co., Ltd.


USPTO Granted Patents = 266


Forward Citations = 689

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197 inventors (with patents filed for the assignee):

goldMedal Yasuhiro Shirakawa (54 out of 65 patents)

silverMedal Yasumasa Ooya (28 out of 33 patents)

bronzeMedal Hiromasa Kato (27 out of 36 patents)

4.  Masahiko Yamakawa (27 out of 34 patents)

5.  Tsutomu Ishii (26 out of 95 patents)

6.  Katsuhiko Yamada (25 out of 37 patents)

7.  Keiichi Fuse (25 out of 25 patents)

8.  Kayo Nakano (21 out of 22 patents)

9.  Hajime Takeuchi (21 out of 53 patents)

10.  Ryo Sakai (19 out of 93 patents)

11.  Akito Sasaki (19 out of 20 patents)

12.  Akira Sato (18 out of 30 patents)

13.  Takayuki Naba (16 out of 24 patents)

14.  Takashi Sano (16 out of 23 patents)

15.  Katsutoshi Nakagawa (14 out of 24 patents)


Core Competencies:
Electrochromic Devices
Ceramic Circuit Boards
Thermoelectric Materials
Sintered Bodies
Scintillator Arrays
Silicon Nitride Substrates
Friction Stir Welding
High-Frequency Acceleration Cavities
Semiconductor Light-Emitting Elements
Bonded Assemblies
Myopia Prevention Technologies
Nano Metal Compounds

266 patents:

1. 12504549 - Scintillator array, method for manufacturing scintillator array, radiation detector, and radiation inspection device (2025-12-23),
2. 12431406 - Bonded body, circuit board, semiconductor device, and method for manufacturing bonded body (2025-09-30),
3. 12414220 - High-frequency acceleration cavity core and high-frequency acceleration cavity in which same is used (2025-09-09),
4. 12396092 - Ceramic circuit board and semiconductor device using same (2025-08-19),
5. 12384959 - Tungsten oxide material, tungsten oxide powder mass for electrochromic device, and slurry for producing electrochromic device (2025-08-12),
6. 12376492 - Rhenium-tungsten wire rod and thermocouple using the same (2025-07-29),
7. 12372843 - Tungsten oxide powder and electrochromic device using the same (2025-07-29),
8. 12371385 - Sliding member, and bearing, motor, and drive device using the same (2025-07-29),
9. 12347744 - Bonded body including titanium alloy at bonding boundary (2025-07-01),
10. 12343820 - Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body (2025-07-01),
11. 12313795 - Scintillator array, method for manufacturing scintillator array, radiation detector, and radiation inspection device (2025-05-27),
12. 12297152 - Silicon nitride sintered body, wear-resistant member using the same, and method for producing silicon nitride sintered body (2025-05-13),
13. 12240218 - Bonded assembly, and ceramic circuit substrate and semiconductor device using the same (2025-03-04),
14. 12187651 - Silicon nitride sintered body, silicon nitride substrate, and silicon nitride circuit board (2025-01-07),
15. 12167534 - Method for manufacturing a ceramic copper circuit board (2024-12-10),
Toshiba Materials Co., Ltd. is a leading Japanese company specializing in advanced materials and components for various industries. With a wide range of innovative products, including semiconductors, electronic devices, and materials for energy management systems, Toshiba Materials aims to contribute to society by creating sustainable solutions. Their commitment to research and development ensures the development of cutting-edge technologies to meet the evolving needs of the market.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 6 2026

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266 Patents

#9 in Yokohama

#557 in Japan

#3,192 in the World

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Yokohama, Japan

Toshiba Materials Co., Ltd.

Forward Citations = 689

197 inventors:

goldMedal Yasuhiro Shirakawa (54 out of 65 patents)

silverMedal Yasumasa Ooya (28 out of 33 patents)

bronzeMedal Hiromasa Kato (27 out of 36 patents)

4.  Masahiko Yamakawa (27 out of 34 patents)

5.  Tsutomu Ishii (26 out of 95 patents)

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