Kabushiki Kaisha Toshiba

Toshiba Materials Co., Ltd.

Maki Yonetsu

Seiichi Suenaga

Tomohiro Suetsuna

Kouichi Harada

Yasuhiro Goto

Koichi Harada

Sachiko Fujisawa

Tomoko Eguchi

Yoshihiko Nakano

Hiroyasu Sumino

Yasushi Hattori

Yasuyuki Hotta

Naoyuki Nakagawa

Norihiro Tomimatsu

Takashi Sano

Kenji Essaki

Shinichi Onodera

Toshihide Takahashi

Yumi Fukuda

Keiko Albessard

Masahiro Takashita

Hideyuki Ohzu

Hitomi Saito

Hideyuki Oozu

Masatoshi Sakurai

Katsuyuki Naito

Satoshi Mikoshiba

Shinya Sakurada

Mutsuki Yamazaki

Fumihiko Aiga

Shinji Murai

Wu Mei

Makoto Higaki

Shuji Hayase

Akihiro Tsujimura

Takayuki Naba

Akihiro Horiguchi

Noritsugu Shiokawa

Mitsuru Ishibashi

Ryosuke Yagi

Naoto Ito

Nao Kobayashi

A bonded body according to an embodiment comprises a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Cu, Ti, and a first element being one or two selected from Sn and In, and the bonding layer includes a Ti-rich region in which a ratio (M/M) of a mass Mof Ti to a mass Mof the first element being 0.5 or more and a Ti-poor region in which the ratio (M/M) being 0.1 or less.

Bonded body, circuit board, semiconductor device, and method for manufacturing bonded body

A bonded body includes a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Ag, Cu, Ti, and a first element being one or two selected from Sn and In, a Ti alloy of Ti and at least one selected from Ag, Cu, Sn, and In existing at a bonding boundary between the copper plate and the bonding layer, and the Ti alloy existing over not less than 30% per a length of 30 μm at the bonding boundary.

Bonded body including titanium alloy at bonding boundary

According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate and a metal plate, the brazing material has an endothermic peak within a range of not less than 550° C. and not more than 700° C. in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550° C. and not more than 650° C. in the heating process.

Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body

According to one embodiment, a structure according to the embodiment includes a β type silicon nitride type crystal phase and a YSiONtype crystal phase. In an X-ray diffraction pattern according to a θ-2θ method of the structure, a ratio of a second peak intensity being maximum and appearing at 2θ=31.93±0.1° with respect to a first peak intensity being maximum and appearing at 2θ=27.03±0.1° is 0.005 or more and 0.20 or less.

Structure and bonded body

A bonded body includes a ceramic substrate and a copper plate, in which the copper plate is bonded to the ceramic substrate via a bonding layer, the copper plate includes a surface perpendicular to a direction in which the ceramic substrate and the copper plate are bonded, and a number percentage of copper crystal grains having major diameters greater than 400 μm in three 5 mm×5 mm regions included in the surface is not less than 0% and not more than 5%. The bonding temperature is favorably not more than 800° C. The number percentage of the copper crystal grains having major diameters greater than 400 μm is favorably not more than 1%.

Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board

A bonded body according to an embodiment includes a ceramic substrate, a copper plate, and a bonding layer that is located on at least one surface of the ceramic substrate and bonds the ceramic substrate and the copper plate. The bonding layer includes titanium. The bonding layer includes first and second regions; the first region includes a layer including titanium as a major component; the layer is formed at an interface of the bonding layer with the ceramic substrate; and the second region is positioned between the first region and the copper plate. The bonded body has a ratio M1/M2 of a titanium concentration M1 at % in the first region and a titanium concentration M2 at % in the second region that is not less than 0.1 and not more than 5 when the Ti concentrations are measured by EDX respectively in measurement regions in the first and second regions.

Bonded body, ceramic copper circuit substrate, and semiconductor device

A bonded body according to an embodiment includes a substrate, a metal member, and a bonding layer. The bonding layer is provided between the substrate and the metal member. The bonding layer includes a first particle including carbon, a first region including a metal, and a second region including titanium. The second region is provided between the first particle and the first region. A concentration of titanium in the second region is greater than a concentration of titanium in the first region.

Bonded body, circuit board, and semiconductor device

A structure according to the embodiment includes a first crystal grain, a second crystal grain, and a first region. The first crystal grain includes silicon nitride. The second crystal grain includes a first element selected from a first group consisting of scandium, yttrium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, aluminum, chromium, zirconium, magnesium, zinc, titanium, gallium, beryllium, calcium, strontium, barium, hafnium, vanadium, niobium, tantalum, tungsten, iron, cobalt, nickel, and copper, and oxygen. The first region includes an oxide of the first element.

Structure and circuit board

A structure includes: a &#x3b2; silicon nitride crystal phase; and a YMgSiON crystal phase. The structure gives a X-ray diffraction pattern by a &#x3b8;-2&#x3b8; method, the pattern having a ratio of a peak intensity of a (22-1) plane of the YMgSiON crystal phase to a peak intensity of a (200) plane of the &#x3b2; silicon nitride crystal phase, the peak intensity of the (200) plane being determined at a position of 2&#x3b8;=27.0&#xb1;1&#xb0;, the peak intensity of the (22-1) plane being determined at a position of 2&#x3b8;=30.3&#xb1;1&#xb0;, and the ratio being 0.001 or more and 0.01 or less.

Structure and joined composite

A vapor separator in an embodiment is arranged between a first space and a second space, and is used to allow vapor existing in the first space to permeate the second space by making a vapor pressure in the second space lower than a vapor pressure in the first space. The vapor separator in the embodiment includes: a porous body having a first face, a second face opposite to the first face, and fine pores passing from the first face to the second face; and a soluble absorbent existing in the fine pores of the porous body.

Vapor separator and dehumidifier using the same

A vapor separator in an embodiment is arranged between a first space and a second space, and is used to allow vapor existing in the first space to permeate in the second space by making a vapor pressure in the second space lower than a vapor pressure in the first space. The vapor separator in the embodiment includes: a porous body including a first face in contact with the first space and having a convexo-concave structure, a second face in contact with the second space, and fine pores passing to the second face from at least wall of the first face which constitutes the convexo-concave structure; and water existing in the fine pores of the porous body.

A core-shell magnetic material having an excellent characteristic in a high-frequency band, in particular a GHz-band and a high environment resistance is provided. The core-shell magnetic material includes: a magnetic member in which plural core-shell magnetic particles are bound by a binder made of a first resin; and a coating layer that is made of a second resin different from the first resin, a surface of the magnetic member being covered with the coating layer. The core-shell magnetic material is characterized in that the core-shell magnetic particle includes a magnetic metallic particle and a covering layer that covers at least part of a surface of the magnetic metallic particle, the magnetic metallic particle contains at least one magnetic metal selected from a group consisting of Fe, Co, and Ni, and the covering layer is made of an oxide, a nitride, or a carbide that contains at least one magnetic metal.

Core-shell magnetic material, method for producing core-shell magnetic material, device, and antenna device

A metal-containing particle aggregate of an embodiment of the present invention includes a plurality of core-shell particles. Each of the core-shell particles includes: a core portion that contains at least one magnetic metal element selected from the first group consisting of Fe, Co, and Ni, and at least one metal element selected from the second group consisting of Mg, Al, Si, Ca, Zr, Ti, Hf, Zn, Mn, rare-earth elements, Ba, and Sr; and a shell layer that includes a carbon-containing material layer and an oxide layer that covers at least part of the core portion and includes at least one metal element that belongs to the second group and is contained in the core portion.

Metal-containing particle aggregate, metal-containing particle composite member, and method of manufacturing the aggregate and the composite member

The carbon fibers of this invention is characterized in that irreducible inorganic material particles in a mean primary particle size below 500 nm and reducible inorganic material particles in a mean primary particle size below 500 nm were mixed by pulverizing and then, the mixture was heat treated under the reducing atmosphere and metal particles in a mean particle size below 1 &#x3bc;m were obtained, and the mixed powder of the thus obtained metal particles with the irreducible inorganic material particles are included in the carbon fibers.

Electrode catalyst material comprising carbon nano-fibers having catalyst particles on the surface and in the insides of the interior area and a fuel cell having the electrode catalyst material

The present invention provides a small antenna device realizing both miniaturization including lower profile and a broader band in a frequency band of hundreds MHz to 5 GHz and which can be mounted on a small device such as a cellular phone. An antenna device includes: a finite ground plane; a rectangular conductor plate provided above the finite ground plane, whose one side is connected to the finite ground plane, and having a bent portion substantially parallel with the one side; an antenna disposed substantially parallel with the finite ground plane above the finite ground plane, extending in a direction substantially perpendicular to the one side, and having a feeding point positioned near the other side facing the one side of the rectangular conductor plate; and a magnetic material provided in at least a part of space between the finite ground plane and the antenna.

Growing community of inventors

Tokyo, Japan

Maki Yonetsu