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Makarem A Hussein

This inventor holds 28 USPTO granted patents and 2 EPO patents, primarily in Semiconductor Manufacturing. Top assignees: Intel Corporation, Honeywell International Inc., Tokyo Ohka Kogyo Co., Ltd.. Active years: 1998-2015.

USPTO Granted Patents = 28

% Patents Active = 71.4

EPO Patents = 2

Average Co-Inventor Count = 2.7

ph-index = 14

Forward Citations = 529(Granted Patents)

Company Filing History:

Honeywell International Inc.

patents

1 out of 1,236

Tokyo Ohka Kogyo Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 1998-2015

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Areas of Expertise:

Antireflective Coatings

Dielectric Spacers

Semiconductor Substrate

Polymer Memory Device

Continuous Metal Interconnects

Damascene Process

Electroplating Process

Thermoelectric Cooling

Interlayer Dielectric

Transistor Fabrication

Photoimageable Material

Patterning Techniques

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8992806 - Antireflective coatings for via fill and photolithography applications and methods of preparation thereof (2015-03-31),

2. 8394701 - Dielectric spacers for metal interconnects and method to form the same (2013-03-12),

3. 8053159 - Antireflective coatings for via fill and photolithography applications and methods of preparation thereof (2011-11-08),

4. 7923760 - Dielectric spacers for metal interconnects and method to form the same (2011-04-12),

5. 7659196 - Soluble hard mask for interlayer dielectric patterning (2010-02-09),

6. 7649239 - Dielectric spacers for metal interconnects and method to form the same (2010-01-19),

7. 7442675 - Cleaning composition and method of cleaning semiconductor substrate (2008-10-28),

8. 7326981 - Methods and apparatuses for producing a polymer memory device (2008-02-05),

9. 7166922 - Continuous metal interconnects (2007-01-23),

10. 7157380 - Damascene process for fabricating interconnect layers in an integrated circuit (2007-01-02),

11. 7078754 - Methods and apparatuses for producing a polymer memory device (2006-07-18),

12. 7071554 - Stress mitigation layer to reduce under bump stress concentration (2006-07-04),

13. 7008872 - Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures (2006-03-07),

14. 6981380 - Thermoelectric cooling for microelectronic packages and dice (2006-01-03),

15. 6958547 - Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs (2005-10-25),

Title: The Inventor Makarem A Hussein: Pioneering Innovations in Beaverton

Introduction: Makarem A Hussein is a distinguished inventor based in Beaverton, Oregon, known for his groundbreaking contributions to various fields.

Latest Patents: Makarem A Hussein holds several patents in the areas of technology and engineering, showcasing his commitment to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Makarem A Hussein has worked on numerous projects that have revolutionized industries and improved the lives of many.

Collaborations: Throughout his career, Makarem A Hussein has collaborated with leading experts, researchers, and companies to bring his innovative ideas to life, fostering a culture of creativity and progress.

Conclusion: Makarem A Hussein's passion for innovation and his dedication to creating impactful solutions continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.

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