IDiyas

For the Inventor, By the Inventor

Dallas, TX, United States of America

Makarand Ramkrishna Kulkarni

USPTO Granted Patents = 15 

Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 31(Granted Patents)


Location History:

  • Richardson, TX (US) (2010 - 2013)
  • Dallas, TX (US) (2019 - 2024)

Company Filing History:

goldMedal15 out of 29,232 
 
Texas Instruments Corporation
 patents

Years Active: 2010-2025

Loading Chart...
15 patents (USPTO):Explore Patents
1. 12406915 - Plated metal layer in power packages (2025-09-02),
2. 12322856 - Antenna in package having antenna on package substrate (2025-06-03),
3. 12211800 - Semiconductor package with shunt and patterned metal trace (2025-01-28),
4. 12015019 - Stacked die multichip module package (2024-06-18),
5. 11955479 - Packaged semiconductor device (2024-04-09),
6. 11784114 - Plated metal layer in power packages (2023-10-10),
7. 11430720 - Recess lead for a surface mount package (2022-08-30),
8. 11217460 - Multiple underfills for flip chip packages (2022-01-04),
9. 11160163 - Electronic substrate having differential coaxial vias (2021-10-26),
10. 11081472 - Stacked die multichip module package (2021-08-03),
11. 10475786 - Packaged semiconductor device (2019-11-12),
12. 8614143 - Simultaneous via and trench patterning using different etch rates (2013-12-24),
13. 8379433 - 3T DRAM cell with added capacitance on storage node (2013-02-19),
14. 7855090 - In line test circuit and method for determining interconnect electrical properties and integrated circuit incorporating the same (2010-12-21),
15. 7786475 - In-line test circuit and method for determining interconnect electrical properties and integrated circuit incorporating the same (2010-08-31),

Title: Makarand Ramkrishna Kulkarni: Innovator in Semiconductor Technology

Introduction

Makarand Ramkrishna Kulkarni is a prominent inventor based in Dallas, TX (US). He has made significant contributions to the field of semiconductor technology, holding a total of 15 patents. His innovative work has advanced the design and functionality of semiconductor packages, making them more efficient and effective.

Latest Patents

Among his latest patents is a design for a plated metal layer in power packages. This invention features a multi-layer package substrate that includes first and second metal layers, with the first layer positioned above the second and connected through a via. The substrate is also equipped with a dielectric covering and a plated metal layer that enhances the overall thickness and performance of the package. Another notable patent is for an antenna in package design, which integrates an IC die and a package substrate. This design includes a top layer with a dielectric and metal layer that houses an antenna, ensuring efficient electrical coupling through filled vias.

Career Highlights

Makarand Kulkarni is currently employed at Texas Instruments Corporation, where he continues to push the boundaries of semiconductor innovation. His work has not only contributed to the company's success but has also set new standards in the industry.

Collaborations

Throughout his career, Makarand has collaborated with talented individuals such as Yiqi Tang and Rajen Manicon Murugan. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Makarand Ramkrishna Kulkarni is a distinguished inventor whose work in semiconductor technology has led to numerous patents and innovations. His contributions continue to shape the future of the industry, making him a key figure in the field.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…