The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Dec. 30, 2020
Texas Instruments Incorporated, Dallas, TX (US);
Yiqi Tang, Allen, TX (US);
Makarand Ramkrishna Kulkarni, Dallas, TX (US);
Liang Wan, Chengdu, CN;
Rajen Manicon Murugan, Dallas, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
An antenna in package (AIP)includes an IC dieincluding bond padsand a package substrate including the IC die mounted up and being completely embedded therein. The package substrate includes a top layerincluding a top dielectric layer, a top metal layerincluding an antenna, and a bottom layerincluding a bottom dielectricand a bottom metal layerincluding contact pads including a first contact pad, and filled vias. The bond pads are electrically coupled by a connection including a filled via(s) for connecting to the top metal layer and/or the bottom metal layer. Metal pillars including a first metal pillarare electrically are coupled to the first contact pad, and at least one filled via is electrically coupled to the first metal pillar for providing a transmission line from the first contact pad to the antenna.