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Li-Han Hsu

This inventor holds 50 USPTO granted patents and 14 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., National Yang Ming Chiao Tung University, Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2011-2026.

USPTO Granted Patents = 50 (Patent Applications = 14)

% Patents Active = 92.0

Average Co-Inventor Count = 5.7

ph-index = 8

Forward Citations = 1,195(Granted Patents)

Company Filing History:

41 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 1,244

National Yang Ming Chiao Tung University

patents

3 out of 463

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

4. 2 out of 786

Wistron Neweb Corporation

patents

5. 1 out of 834,411

Other

patents

Years Active: 2011-2026

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Areas of Expertise:

Semiconductor Package

Redistribution Layers

Integrated Circuits

Conductive Vias

Stacked Via Structure

Dummy Features

Package Structures

Orientation-Adjustment Mechanism

Integrated Fan-Out Package

Chip-On-Wafer Process

Padding Layer

Shielding Plate

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12721220 - Methods of forming packages and resulting structures (2026-08-25),

2. 12721173 - Seal rings in integrated circuit package and method (2026-08-25),

3. 12550737 - Semiconductor package and method (2026-02-10),

4. 12506087 - Semiconductor package with redistribution structure and manufacturing method thereof (2025-12-23),

5. 12322726 - Method of forming an integrated circuit package having a padding layer on a carrier (2025-06-03),

6. 12320468 - Communication apparatus and bracket device thereof (2025-06-03),

7. 12205866 - Semiconductor device (2025-01-21),

8. 12191239 - Stacked via structure disposed on a conductive pillar of a semiconductor die (2025-01-07),

9. 12191224 - Semiconductor package and manufacturing method thereof (2025-01-07),

10. 11955439 - Semiconductor package with redistribution structure and manufacturing method thereof (2024-04-09),

11. 11756870 - Stacked via structure disposed on a conductive pillar of a semiconductor die (2023-09-12),

12. 11652063 - Semiconductor package and method of forming the same (2023-05-16),

13. 11638360 - Orientation-adjustment mechanism (2023-04-25),

14. 11612057 - Opening in the pad for bonding integrated passive device in InFO package (2023-03-21),

15. 11581268 - Semiconductor package with redistribution structure and manufacturing method thereof (2023-02-14),

Title: The Innovative Journey of Inventor Li-Han Hsu

Introduction: Li-Han Hsu, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Li-Han Hsu's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, and a sustainable energy solution that aims to tackle environmental challenges.

Career Highlights: Throughout his illustrious career, Li-Han Hsu has been recognized for his exceptional problem-solving skills and creativity. His inventions have not only improved efficiency in various industries but have also positively impacted the lives of many.

Collaborations: Li-Han Hsu has collaborated with leading tech companies and research institutions to further develop his inventions. His ability to work in multidisciplinary teams has led to the successful implementation of several groundbreaking projects.

Conclusion: In conclusion, Li-Han Hsu's passion for innovation and his dedication to creating solutions for real-world problems make him a true pioneer in the world of technology. His inventive spirit continues to inspire future generations of inventors worldwide.

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