Sunnyvale, CA, United States of America

Leilei Zhang

This inventor holds 32 USPTO granted patents and 7 published patent applications, plus 1 CIPO patent and 2 EPO patents, primarily in Integrated Circuit Packaging. Top assignees: Nvidia Corporation, Xilinx, Inc., Apple Inc.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leilei Zhang. Retrieved from https://idiyas.com/inventor/leilei-zhang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 32 

% Patents Active = 90.6



Average Co-Inventor Count = 1.5

ph-index = 5

Forward Citations = 87(Granted Patents)


Location History:

  • Santa Clara, CA (US) (2015)
  • Sunnyvale, CA (US) (2004 - 2024)

Company Filing History:


Years Active: 2004-2026

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Areas of Expertise:
Integrated Circuit Package
Solder Bump Structures
Flexible Module
Thermopile
Thermal Management
High Density Microvias
Packaging Substrate
Stress-Tolerant Solder
Lead-Free Structures
Chip Package
Circuit Board Analysis
Photonic Soldering
32 patents (USPTO):Explore Patents

Title: Leilei Zhang: Innovator in Photonic Soldering Technology

Introduction

Leilei Zhang, based in Sunnyvale, California, is an accomplished inventor with an impressive portfolio of 31 patents. His work primarily focuses on advancements in electronic assembly methods, showcasing his commitment to innovation in the electronics industry.

Latest Patents

Zhang’s recent patents include groundbreaking technologies such as selective soldering with photonic soldering technology. This electronic assembly method revolutionizes how electronic components are bonded to routing substrates by utilizing a large area photonic soldering light pulse. Another notable invention is the development of flexible modules and methods of manufacture, which features a flex board where a passivation layer is applied in liquid form. This innovative process allows for the mounting of electronic components directly onto the flex board, encapsulated in a molding compound.

Career Highlights

Throughout his career, Leilei Zhang has made significant contributions while working with prominent companies such as Nvidia Corporation and Xilinx, Inc. His expertise and inventive spirit have been instrumental in the progression of electronic assembly techniques.

Collaborations

Zhang has collaborated with skilled individuals like Zuhair Bokharey and Abraham Fong Yee. These professional relationships have facilitated the exchange of ideas and technological developments, further enriching Zhang’s contributions to the field.

Conclusion

Leilei Zhang stands out as a dedicated inventor committed to pushing the boundaries of electronic assembly technology. With a notable number of patents to his name and ongoing contributions to the industry, his work continues to shape the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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