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Leilei Zhang

This inventor holds 32 USPTO granted patents and 7 published patent applications, plus 1 CIPO patent and 2 EPO patents. Top assignees: Nvidia Corporation, Xilinx, Inc., Apple Inc.. Active years: 2004-2026.

USPTO Granted Patents = 32 (Patent Applications = 7)

% Patents Active = 90.6

CIPO Patents = 1

EPO Patents = 2

Average Co-Inventor Count = 1.5

ph-index = 5

Forward Citations = 87(Granted Patents)

Location History:

Santa Clara, CA (US) (2015)
Sunnyvale, CA (US) (2004 - 2024)

Company Filing History:

Years Active: 2004-2026

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Areas of Expertise:

Photonic Soldering Technology

Flexible Module

Integrated Circuit Packaging

High Density Microvias

Conductive Grid

Stiffener Ring

Low-Profile Chip Package

Solder Bump Structures

Microelectronic Package

Lead-Free Structures

Circuit Board Analysis

Flip Chip Packages

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12638338 - System and method for temperature sensing using thermopile integrated with rigid printed circuit board (2026-05-26),

2. 12041728 - Selective soldering with photonic soldering technology (2024-07-16),

3. 12040262 - Flex board and flexible module (2024-07-16),

4. 11462461 - System in package for lower z height and reworkable component assembly (2022-10-04),

5. 10602612 - Vertical module and perpendicular pin array interconnect for stacked circuit board structure (2020-03-24),

6. 10219387 - Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate (2019-02-26),

7. 9831189 - Integrated circuit package with a conductive grid formed in a packaging substrate (2017-11-28),

8. 9760132 - Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad (2017-09-12),

9. 9716051 - Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity (2017-07-25),

10. 9530714 - Low-profile chip package with modified heat spreader (2016-12-27),

11. 9502355 - Bottom package having routing paths connected to top package and method of manufacturing the same (2016-11-22),

12. 9478482 - Offset integrated circuit packaging interconnects (2016-10-25),

13. 9385098 - Variable-size solder bump structures for integrated circuit packaging (2016-07-05),

14. 9368439 - Substrate build up layer to achieve both finer design rule and better package coplanarity (2016-06-14),

15. 9368422 - Absorbing excess under-fill flow with a solder trench (2016-06-14),

Title: Leilei Zhang: Innovator in Photonic Soldering Technology

Introduction

Leilei Zhang, based in Sunnyvale, California, is an accomplished inventor with an impressive portfolio of 31 patents. His work primarily focuses on advancements in electronic assembly methods, showcasing his commitment to innovation in the electronics industry.

Latest Patents

Zhang’s recent patents include groundbreaking technologies such as selective soldering with photonic soldering technology. This electronic assembly method revolutionizes how electronic components are bonded to routing substrates by utilizing a large area photonic soldering light pulse. Another notable invention is the development of flexible modules and methods of manufacture, which features a flex board where a passivation layer is applied in liquid form. This innovative process allows for the mounting of electronic components directly onto the flex board, encapsulated in a molding compound.

Career Highlights

Throughout his career, Leilei Zhang has made significant contributions while working with prominent companies such as Nvidia Corporation and Xilinx, Inc. His expertise and inventive spirit have been instrumental in the progression of electronic assembly techniques.

Collaborations

Zhang has collaborated with skilled individuals like Zuhair Bokharey and Abraham Fong Yee. These professional relationships have facilitated the exchange of ideas and technological developments, further enriching Zhang’s contributions to the field.

Conclusion

Leilei Zhang stands out as a dedicated inventor committed to pushing the boundaries of electronic assembly technology. With a notable number of patents to his name and ongoing contributions to the industry, his work continues to shape the future of electronics.

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