The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Jul. 21, 2021
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Dennis R. Pyper, San Jose, CA (US);
Leilei Zhang, Sunnyvale, CA (US);
Lan H. Hoang, Los Gatos, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/58 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 23/49894 (2013.01); H01L 23/58 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/4985 (2013.01); H01L 24/16 (2013.01); H01L 25/105 (2013.01); H01L 2224/16227 (2013.01);
Abstract
Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.