Lan H Hoang

This inventor holds 35 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignees: Apple Inc., Xilinx, Inc., Stats Chippac Pte. Ltd.. Active years: 1999-2026.

USPTO Granted Patents = 35 (Patent Applications = 4)

% Patents Active = 94.3

Average Co-Inventor Count = 3.0

ph-index = 10

Forward Citations = 357(Granted Patents)

Location History:

Fremont, CA (US) (2002 - 2010)
San Jose, CA (US) (1999 - 2020)
Cupertino, CA (US) (2020)
Los Gatos, CA (US) (2019 - 2024)

Company Filing History:

Stats Chippac Pte. Ltd.

patents

4. 3 out of 3,715

Lsi Logic Corporation

patents

5. 1 out of 4,791

National Semiconductor Corporation

patents

6. 1 out of 3

Utac - United Test and Assembly Test Center Ltd.

patents

where one patent can have more than one assignee

Years Active: 1999-2026

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Areas of Expertise:

Optical Packages

Button Interconnects

Photonic Soldering

Flex Boards

Electrical Components

System-In-Package

Vertical Shielding

Flip-Chip Packages

High Density Packaging

Thermal Management

Molded Integrated Circuits

Multi-Chip Configuration

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12638338 - System and method for temperature sensing using thermopile integrated with rigid printed circuit board (2026-05-26),

2. 12153268 - Technologies for increased volumetric and functional efficiencies of optical packages (2024-11-26),

3. 12148741 - Sidewall connections and button interconnects for molded SiPs (2024-11-19),

4. 12095185 - Built-in connector for board-to-board and flex-to-rigid board connection (2024-09-17),

5. 12041728 - Selective soldering with photonic soldering technology (2024-07-16),

6. 12040262 - Flex board and flexible module (2024-07-16),

7. 11765838 - Right angle sidewall and button interconnects for molded SiPs (2023-09-19),

8. 11462461 - System in package for lower z height and reworkable component assembly (2022-10-04),

9. 11388817 - Electrical components attached to fabric (2022-07-12),

10. 10966321 - System-in-package including opposing circuit boards (2021-03-30),

11. 10959331 - Electrical components attached to fabric (2021-03-23),

12. 10709018 - System-in-package including opposing circuit boards (2020-07-07),

13. 10701802 - Electrical components attached to fabric (2020-06-30),

14. 10638608 - Interconnect frames for SIP modules (2020-04-28),

15. 10624214 - Low-profile space-efficient shielding for SIP module (2020-04-14),

Title: The Innovative Mind of Lan H Hoang

Introduction: Lan H Hoang is a pioneering inventor based in San Jose, CA, known for her groundbreaking contributions to various fields.

Latest Patents: Lan H Hoang holds several patents in the areas of technology and healthcare, showcasing her versatility and ingenuity.

Career Highlights: With a career spanning over two decades, Lan H Hoang has consistently pushed the boundaries of innovation, leading to significant advancements in her respective industries.

Collaborations: Lan H Hoang has collaborated with top research institutions and universities, further solidifying her reputation as a forward-thinker and a collaborative partner in the world of inventions.

Conclusion: Lan H Hoang's dedication to innovation and her passion for creating solutions to complex problems make her a standout figure in the realm of inventors.