The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Jun. 10, 2022
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Bilal Mohamed Ibrahim Kani, Singapore, SG;
Ali N. Ergun, Sunnyvale, CA (US);
Kishore N. Renjan, Singapore, SG;
Kyusang Kim, Singapore, SG;
Manoj Vadeentavida, Singapore, SG;
Benjamin J. Grena, San Francisco, CA (US);
David M. Kindlon, Felton, CA (US);
Lan H. Hoang, Los Gatos, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G01D 11/24 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01R 12/59 (2011.01); H01R 12/62 (2011.01); H01R 12/79 (2011.01); H01R 13/6581 (2011.01); H01R 43/20 (2006.01); H05K 1/18 (2006.01); H05K 3/14 (2006.01); H05K 3/18 (2006.01); H10K 59/131 (2023.01);
U.S. Cl.
CPC ...
H01L 25/162 (2013.01); G01D 11/245 (2013.01); H01L 21/56 (2013.01); H01L 23/315 (2013.01); H01L 23/4985 (2013.01); H01L 25/165 (2013.01); H01R 12/592 (2013.01); H01R 12/62 (2013.01); H01R 12/79 (2013.01); H01R 13/6581 (2013.01); H01R 43/205 (2013.01);
Abstract
Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.