The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Feb. 11, 2016
Apple Inc., Cupertino, CA (US);
Amir Salehi, Cupertino, CA (US);
Takayoshi Katahira, Cupertino, CA (US);
Vu T. Vo, Cupertino, CA (US);
Wyeman Chen, Cupertino, CA (US);
Chang Liu, San Jose, CA (US);
Dennis R. Pyper, Cupertino, CA (US);
Steven Patrick Cardinali, Cupertino, CA (US);
Lan Hoang, Cupertino, CA (US);
Siddharth Nangia, Cupertino, CA (US);
Meng Chi Lee, Los Altos, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.