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For the Inventor, By the Inventor

Los Altos, CA, United States of America

Meng Chi Lee

This inventor holds 26 USPTO granted patents and 6 published patent applications, primarily in System-in-Package Technology. Top assignee: Apple Inc.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng Chi Lee. Retrieved from https://idiyas.com/inventor/meng-chi-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 80.8

Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 59(Granted Patents)


Location History:

  • Cupertino, CA (US) (2018 - 2022)
  • Los Altos, CA (US) (2016 - 2024)

Company Filing History:

goldMedal26 out of 43,562 
 
Apple Inc.
 patents

Years Active: 2016-2026

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Areas of Expertise:
System-in-Package
Battery Expansion Control
Thin Substrate Manufacturing
Photonic Soldering
Vertical Interconnects
EMI Shielding
Low-Spurious Inductor
Substrate-Less Components
Printed Circuit Board
Self Shielded Modules
Connectivity Solutions
SIP Devices
26 patents (USPTO):Explore Patents
1. 12645256 - Computing device case (2026-06-02),
2. 12596400 - Computing device case (2026-04-07),
3. 12591270 - Computing device case (2026-03-31),
4. 12287680 - Computing device case (2025-04-29),
5. 12041728 - Selective soldering with photonic soldering technology (2024-07-16),
6. 12035466 - Systems and methods for manufacturing thin substrate (2024-07-09),
7. 11539086 - Methods for determining and controlling battery expansion (2022-12-27),
8. 11164694 - Low-spurious electric-field inductor design (2021-11-02),
9. 10991659 - Substrate-less integrated components (2021-04-27),
10. 10966321 - System-in-package including opposing circuit boards (2021-03-30),
11. 10847846 - Methods for determining and controlling battery expansion (2020-11-24),
12. 10709018 - System-in-package including opposing circuit boards (2020-07-07),
13. 10631410 - Stacked printed circuit board packages (2020-04-21),
14. 10624214 - Low-profile space-efficient shielding for SIP module (2020-04-14),
15. 10535611 - Substrate-less integrated components (2020-01-14),

Title: Inventor Meng Chi Lee

Introduction: Meng Chi Lee is a renowned inventor based in Los Altos, CA (US) known for his groundbreaking contributions to various technological fields.

Latest Patents: Meng Chi Lee holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and innovation.

Career Highlights: With a career spanning over two decades, Meng Chi Lee has worked with leading tech companies and research institutions, consistently pushing the boundaries of innovation and creating solutions to complex problems.

Collaborations: Throughout his career, Meng Chi Lee has collaborated with top scientists, engineers, and researchers globally, fostering a culture of innovation and knowledge sharing in the industry.

Conclusion: Meng Chi Lee's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, shaping the future of technology and inspiring the next generation of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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