Apple Inc.

Meng Chi Lee

Flynn P Carson

Shakti Singh Chauhan

Jun Chung Hsu

Lan H Hoang

Shankar S Pennathur

Daniel William Jarvis

Yanfeng Chen

Tha-An Lin

Richard Hung Minh Dinh

Richard M Mank

Hongli Dai

Dennis R Pyper

Amir Salehi

Vijayasekaran Boovaragavan

Rishabh Bhargava

Julian Malinski

Julien Marcil

Steven D Sterz

Mandar Painaik

Mark J Beesley

Daniel P Kumar

Wyeman Chen

Soundararajan Manthiri

Vu Thanh Vo

David M Demuro

David A Pakula

Eric Steven Jol

Jun Zhai

Ian A Spraggs

Steven P Cardinali

Phillip R Sommer

Parin Patel

Shawn Xavier Arnold

Andrew W Joyce

Ehsan Khajeh

Leilei Zhang

Gregory N Stephens

Stephen Theodore Schooley

Arash Akhavan Fomani

Chang Liu

Karan S Jain

Derek J Walters

Supratik Datta

Alex J Crumlin

Adrian E Sun

Hao Dong

Rajarshi Paul

Siddharth Nangia

Michael Victor Yeh

Ross D Arriens

Gang Ning

Takayoshi Katahira

Jenna Dancy

Craig Harvey Prouse

Corey S Provencher

Hao Shi

Scott L Gooch

Eng Eow Goh

Maciej Maciesowicz

Siji Menokki Kandiyil

Deepak Sharma

Timothy C Wulff

Nima Shahidi

Quan Qi

Jason P Marsh

Yashar Abdollahian

Chengrui Zhang

Michael Sipper

Maryam Rahimi

Soundarajan Manthiri

Frank Y Yuan

Xinbo He

Kenneth Leland Kiplinger

Shyam Harindralal Ratnayake

Ayewin Oung

Shatki S Chauhan

David M DeMuro

A case for an electronic device can include a case body including an exterior surface and an interior surface, the interior surface being positioned opposite the exterior surface. The case can additionally include a button body positioned at least partially within the case body between the exterior surface and the interior surface, the button body being movable inward and outward relative to the case body along an axis of button travel. The case can further include a biasing structure having a contact surface configured to contact the button body, the biasing structure configured to bias the button body toward the interior surface along the axis of button travel.

Computing device case

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Selective soldering with photonic soldering technology

Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

Systems and methods for manufacturing thin substrate

Methods and systems for detecting and compensating for expansion of rechargeable batteries over time. An expansion detector may be coupled to or positioned proximate a rechargeable battery to monitor for expansion thereof. After expansion exceeding a selected threshold is detected, the expansion detector may report the expansion to an associated processing unit. The processing unit may undertake to arrest further rechargeable battery expansion by modifying or changing one or more characteristics of charging and/or discharging circuitry coupled to the rechargeable battery. For example, the processing unit may charge the rechargeable battery at a lower rate or with reduced voltage after detecting expansion.

Methods for determining and controlling battery expansion

Inductors that generate a reduced spurious electric-field. One example can provide an inductor where the terminals of the inductor are located at positions that reduce the spurious electric field by determining the types of signals conveyed at the terminals of the inductor and then selecting locations for the terminals based on that determination. For example, where a dynamic differential signal is applied to the inductor, the terminals of the inductor can be positioned near a physical center of the inductor.

Low-spurious electric-field inductor design

Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.

Substrate-less integrated components

System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

System-in-package including opposing circuit boards

The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

Stacked printed circuit board packages

Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

Low-profile space-efficient shielding for SIP module

A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.

Vertical interconnects for self shielded system in package (SiP) modules

Described herein are printed circuit boards (PCBs), PCB assemblies, and methods of manufacture thereof, which allow free placement of electrical components. The PCBs may have electrical pads that may couple to components through via-based connections and without the use of solder. The electrical components may be physically attached to the PCBs through tight fitting, lamination, and/or the use of adhesives. The distance between adjacent vias may be reduced, as accidental short-circuit risks due to solder bridging and similar effects are mitigated when the soldering process is bypassed. The PCB design and component placement may be flexible as to allow the use of electrical components with custom shape and/or customized terminal placement.

Connection pad for embedded components in PCB packaging

Growing community of inventors

Los Altos, CA, United States of America

Meng Chi Lee