The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Sep. 20, 2017
Apple Inc., Cupertino, CA (US);
Corey S. Provencher, Santa Clara, CA (US);
Meng Chi Lee, Los Altos, CA (US);
Derek J. Walters, San Jose, CA (US);
Ian A. Spraggs, San Francisco, CA (US);
Flynn P. Carson, Redwood City, CA (US);
Shakti S. Chauhan, Cupertino, CA (US);
Daniel W. Jarvis, Sunnyvale, CA (US);
David A. Pakula, San Francisco, CA (US);
Jun Zhai, Cupertino, CA (US);
Michael V. Yeh, Cupertino, CA (US);
Alex J. Crumlin, San Jose, CA (US);
Dennis R. Pyper, San Jose, CA (US);
Amir Salehi, Los Gatos, CA (US);
Vu T. Vo, Salinas, CA (US);
Gregory N. Stephens, San Jose, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.