Niskayuna, NY, United States of America

Shakti Singh Chauhan

This inventor holds 29 USPTO granted patents and 8 published patent applications, plus 1 CIPO patent and 12 EPO patents, primarily in Embedded Semiconductor Packaging. Top assignees: General Electric Company, Apple Inc.. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shakti Singh Chauhan. Retrieved from https://idiyas.com/inventor/shakti-singh-chauhan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 100.0


 

Average Co-Inventor Count = 3.9

ph-index = 8

Forward Citations = 151(Granted Patents)


Location History:

  • Guilderland, NY (US) (2016 - 2020)
  • Cupertino, CA (US) (2017 - 2020)
  • Niskayuna, NY (US) (2014 - 2023)

Company Filing History:


Years Active: 2014-2023

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Areas of Expertise:
Embedded Semiconductor
Vertical Interconnects
Thermal Interface Devices
System-in-Package
Power Overlay Structure
Heat Exchange Assembly
Circuit Card Assembly
Self Shielded Modules
Composite Foam
Substrate-less Components
Light Emitting Semiconductors
Surface Mount Integrated Power Module
29 patents (USPTO):Explore Patents

Title: Innovations of Shakti Singh Chauhan: A Pioneer in Semiconductor Technologies

Introduction

Shakti Singh Chauhan, based in Niskayuna, NY, has made significant contributions to the field of semiconductor technologies, holding an impressive total of 29 patents. His work primarily focuses on innovative packaging and heat exchange systems, which strive to push the boundaries of efficiency and functionality in electronics.

Latest Patents

Among Shakti's latest patents is the "Ultra-thin embedded semiconductor device package and method of manufacturing thereof." This invention features a unique package structure that includes a first dielectric layer with semiconductor devices attached, embedded within an innovative material. The design allows for the formation of vias and metal interconnects to create electrical connections to the semiconductor device, leading to enhanced performance in electronic devices. The input/output (I/O) connections strategically placed on the package facilitate a second-level connection to external circuits, enhancing the versatility and application of the device.

Another notable patent is the "Integrated heat exchange assembly and an associated method thereof." This invention involves a sophisticated heat exchange assembly featuring a support structure designed with a recess and multiple projections to enhance heat dissipation. The integration of a vapor chamber within this assembly allows for improved thermal management, making electronic devices more reliable and efficient.

Career Highlights

Shakti Singh Chauhan has held positions at leading technology firms, including General Electric Company and Apple Inc. His extensive experience in these organizations has equipped him with deep insights and expertise in the semiconductor sector. Shakti's contributions in these roles have been instrumental in driving innovative projects aimed at improving electronic device performance.

Collaborations

Throughout his career, Shakti has collaborated with talented professionals, including notable coworkers like Arun Virupaksha Gowda and Paul Alan McConnelee. These collaborations have fostered a dynamic environment for innovation, enhancing the development and implementation of cutting-edge technologies in their projects.

Conclusion

Shakti Singh Chauhan’s extensive patent portfolio and innovative approach to semiconductor technologies underline his significant impact in the field. With a focus on advancing packaging and thermal management solutions, Shakti continues to be a prominent figure in the world of electronics, driving forward the next wave of technological advancements. His achievements serve as an inspiration to inventors and engineers aiming to revolutionize the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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