The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Sep. 08, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Shakti Singh Chauhan, Guilderland, NY (US);

Hendrik Pieter Jacobus De Bock, Clifton Park, NY (US);

Graham Charles Kirk, Milton Keynes, GB;

Stanton Earl Weaver, Jr., Broadalbin, NY (US);

David Shannon Slaton, Huntsville, AL (US);

Tao Deng, Shanghai, CN;

Pramod Chamarthy, Revere, MA (US);

Assignee:

GENERAL ELECTRIC COMPANY, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); H01L 23/40 (2006.01); H01L 23/427 (2006.01); H01L 21/48 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0275 (2013.01); F28D 15/04 (2013.01); H01L 21/4882 (2013.01); H01L 23/36 (2013.01); H01L 23/40 (2013.01); H01L 23/427 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.


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