Huntsville, AL, United States of America

David Shannon Slaton

USPTO Granted Patents = 11 


Average Co-Inventor Count = 1.8

ph-index = 4

Forward Citations = 76(Granted Patents)


Company Filing History:


Years Active: 2007-2020

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11 patents (USPTO):

Title: Innovations of David Shannon Slaton: A Visionary Inventor from Huntsville, AL

Introduction

David Shannon Slaton is a notable inventor based in Huntsville, Alabama, recognized for his contributions to technological advancements. With a remarkable portfolio of 11 patents, Slaton's inventions reflect his dedication to innovation in the field of heat exchange systems and circuit board technology.

Latest Patents

Among his most recent patents is the "Integrated Heat Exchange Assembly and an Associated Method Thereof." This innovative system features a unique support structure designed to optimize heat transfer through a primary heat sink, integrating projections that enhance heat dissipation. Another significant invention is the "Systems for Circuit Board Heat Transfer and Method of Assembling Same," which details a printed circuit board assembly that efficiently transfers heat from the PCB to the chassis, utilizing advanced thermal interface materials and thermal vias to maximize thermal management.

Career Highlights

David Slaton has demonstrated expertise through his work with prominent companies, including General Electric Company and Ge Intelligent Platforms Embedded Systems, Inc. His professional journey reflects a commitment to enhancing technological efficiency and innovation.

Collaborations

Throughout his career, Slaton has collaborated with esteemed colleagues such as David L. McDonald and Mehmet Arik. These partnerships have further propelled his inventive endeavors and contributed to the successful realization of his patents.

Conclusion

David Shannon Slaton stands out as a significant figure in the realm of invention, showcasing his passion for technology and innovation through his numerous patents. His contributions continue to influence advancements in heat exchange systems and circuit board technology, paving the way for future innovations.

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