General Electric Company

Ge Intelligent Platforms Embedded Systems, Inc.

Ge Intelligent Platforms Inc.

David Shannon Slaton

Mehmet Arik

Stanton Earl Weaver, Jr

Hendrik Pieter Jacobus De Bock

Charles Erklin Seeley

Yogen Vishwas Utturkar

Shakti Singh Chauhan

Stanton Earl Weaver

David L McDonald

Tao Deng

Charles Franklin Wolfe, Jr

William Henry Lueckenbach

Graham Charles Kirk

Pramod Chamarthy

Jerry L Wright

Chris Erwin Orr

Shreenath S Perlaguri

Edward M Jory

William Arthur Warner, Ii

David McDonald

A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Integrated heat exchange assembly and an associated method thereof

A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via.

Systems for circuit board heat transfer and method of assembling same

The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.

Heat sink and method of forming a heatsink using a wedge-lock system

A method is provided for assembling a computer that includes a carrier board having a board management controller (BMC), a power supply, and a carrier bus. The method includes coupling a module to the carrier board, determining, by the carrier board, a type of the module, and providing power to the module based on the module type such that a voltage component of the power is one of a first voltage and a second voltage that is different than the first voltage.

Computer including a carrier board and methods of assembly

A thermal management system for an embedded environment is described. The thermal management system includes a pleumo-jet that has at least one wall defining a chamber, at least one piezoelectric device on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening providing fluid communication between said chamber and the embedded environment. A cooling system is also described. A method for making a pleumo-jet is also described.

Thermal management system for embedded environment and method for making same

A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.

Method for coupling a battery within an embedded system

A printed circuit board including a Pconnector, a Pconnector, and a first common connector configured to connect an application-specific connector to the printed circuit board.

Printed circuit board with an adaptable connector module

A cable detection apparatus includes; a plurality of conductors which transmit signal information, a detection control circuit operably connected to a first conductor of the plurality of conductors, wherein the detection control circuit outputs an output signal as a first detection signal when a predetermined signal level is detected from the first conductor and outputs a second detection signal when the predetermined signal level is not detected from the first conductor, and a multiplexer operably connected to the detection control circuit which receives one of the first and second detection signals and selects between a digital signal input and an analog signal input based on the output signal of the detection control circuit and outputs the selected signal input to a conductor of the plurality of conductors.

Cable detection method and apparatus

A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.

Method and system for extracting heat from electrical components

A heat exchange apparatus having a housing that includes a first region and a second region, and a wall separating the first region from the second region, is disclosed. The second region includes a fluid flow entry port and a fluid flow exit port to define a fluid flow path, and a heat exchanger exposed to the fluid flow path. The heat exchanger includes first and second portions in thermal communication with each other, where the first portion is disposed at the first region and the second portion is disposed at the second region. The fluid flow path is isolated from the first region and provides for the removal of heat from the first region.

Apparatus and method for transferring heat from processors

A first circuit board connectable to a second circuit board is disclosed. The first circuit board includes at least one set of contacts, a detection circuit, and a voltage generator. Each set of contacts is configured to receive an electrically conductive keypin for bridging a set of the contacts. The detection circuit is in signal communication with the contacts and produces a logic signal in response to a set of the contacts being bridged. The voltage generator is responsive to the logic signal and produces a voltage signal at a connector connectable to the second circuit board. The voltage signal at the connector has a first voltage in response to the keypin being disposed at a first location, and a second different voltage in response to the keypin being disposed at a second location, wherein at least one of the pin locations results in a set of the contacts being bridged.

Growing community of inventors

Huntsville, AL, United States of America

David Shannon Slaton