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For the Inventor, By the Inventor

San Jose, CA, United States of America

Alex J Crumlin

This inventor holds 12 USPTO granted patents and 6 published patent applications. Top assignee: Apple Inc.. Active years: 2009-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alex J Crumlin. Retrieved from https://idiyas.com/inventor/alex-j-crumlin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 41.7

Average Co-Inventor Count = 4.5

ph-index = 4

Forward Citations = 184(Granted Patents)


Location History:

  • Cupertino, CA (US) (2017 - 2018)
  • San Jose, CA (US) (2009 - 2020)

Company Filing History:

goldMedal12 out of 43,495 
 
Apple Inc.
 patents

Years Active: 2009-2020

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12 patents (USPTO):Explore Patents
1. 10631410 - Stacked printed circuit board packages (2020-04-21),
2. 10455738 - Stacked circuit board architecture in an electronic device (2019-10-22),
3. 10009852 - Cold temperature power throttling at a mobile computing device (2018-06-26),
4. 9585100 - Cold temperature power throttling at a mobile computing device (2017-02-28),
5. 8610726 - Computer systems and methods with projected display (2013-12-17),
6. 8578198 - Controlling power received through multiple bus interfaces in a portable computing device (2013-11-05),
7. 8538084 - Method and apparatus for depth sensing keystoning (2013-09-17),
8. 8378972 - Keyboard with increased control of backlit keys (2013-02-19),
9. 8332667 - Battery disconnection for secure assembly of computer systems (2012-12-11),
10. 8013616 - Type A USB receptacle with plug detection (2011-09-06),
11. 7880475 - Type A USB receptacle with plug detection (2011-02-01),
12. 7635280 - Type A USB receptacle with plug detection (2009-12-22),

Title: Alex J Crumlin: Innovator in Printed Circuit Board Technology

Introduction

Alex J Crumlin is a prominent inventor based in San Jose, CA, known for his significant contributions to the field of printed circuit board technology. With a total of 12 patents to his name, Crumlin has been instrumental in developing innovative solutions that enhance the efficiency and functionality of electronic devices.

Latest Patents

Crumlin's latest patents include groundbreaking designs for stacked printed circuit board packages. This technology relates to methods of assembly that improve the fabrication of electrical devices. The printed circuit board packages are manufactured by stacking printed circuit board assemblies, which can support multiple printed circuit boards within a resin mold. This design not only optimizes space utilization but also accommodates large electrical components attached to the printed circuit board package.

Another notable patent is the stacked circuit board architecture in an electronic device. This invention features a circuit board assembly that includes stacked circuit boards in electrical communication with each other. The design conserves space within the electronic device, allowing for operational components to be positioned efficiently. Additionally, the circuit board assembly incorporates EMI shields to protect the operational components from electromagnetic interference.

Career Highlights

Crumlin is currently employed at Apple Inc., where he continues to push the boundaries of innovation in electronic design. His work has significantly impacted the way electronic devices are constructed, leading to more compact and efficient designs.

Collaborations

Throughout his career, Crumlin has collaborated with talented individuals such as Aaron Leiba and David Ferguson. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Alex J Crumlin stands out as a key figure in the realm of printed circuit board innovation. His contributions have not only advanced technology but have also paved the way for future developments in the electronics industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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