The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Sep. 21, 2017
Apple Inc., Cupertino, CA (US);
David A. Pakula, San Francisco, CA (US);
Daniel W. Jarvis, Sunnyvale, CA (US);
Gregory N. Stephens, Sunnyvale, CA (US);
Ian A. Spraggs, San Francisco, CA (US);
Vu Thanh Vo, Salinas, CA (US);
Amir Salehi, Los Gatos, CA (US);
Dennis R. Pyper, Cupertino, CA (US);
Alex J. Crumlin, San Jose, CA (US);
Corey S. Provencher, Santa Clara, CA (US);
Derek J. Walters, San Jose, CA (US);
Michael V. Yeh, Cupertino, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.