San Jose, CA, United States of America

Amir Salehi

This inventor holds 22 USPTO granted patents and 4 published patent applications, primarily in Circuit Board Technology. Top assignees: Apple Inc., Other. Active years: 2010-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Amir Salehi. Retrieved from https://idiyas.com/inventor/amir-salehi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 22 

% Patents Active = 50.0

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 97(Granted Patents)


Location History:

  • San Jose, CA (US) (2010 - 2017)
  • Los Gatos, CA (US) (2019 - 2020)
  • Cupertino, CA (US) (2020)

Company Filing History:


Years Active: 2010-2020

Loading Chart...
Areas of Expertise:
Stacked Printed Circuit Boards
Electromagnetic Shielding
Connectivity Solutions
Modular Components
Testing Platforms
Induction Bonding
Compact Mounting Arrangements
Removable Test Points
Vias
Low-Profile Shielding
Material Reduction Techniques
Electrical Interfaces
22 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Amir Salehi in Patented Technologies

Introduction

Amir Salehi, located in San Jose, CA, has made significant contributions to the field of technology, accumulating an impressive portfolio of 22 patents. His work predominantly focuses on innovations in printed circuit board packages and related assembly methods, reflecting his dedication to enhancing electrical device fabrication.

Latest Patents

Two of his latest patents exemplify his innovative spirit:

1. **Stacked Printed Circuit Board Packages** – This technology focuses on improving the manufacturing process of printed circuit board packages by stacking assemblies. These packages are designed to optimize space utilization and accommodate large electrical components effectively.

2. **Low-Profile Space-Efficient Shielding for SIP Module** – This patent details readily manufactured structures that ensure the efficient assembly of system-in-a-package (SIP) modules. By incorporating low-profile designs, the SIP modules are not only space-efficient but also easily assembled.

Career Highlights

Amir Salehi has had a substantial career, including a notable tenure at Apple Inc. His expertise in innovations related to printed circuit boards has significantly influenced the development of various high-tech products. His dedication to improving electrical device assembly has garnered attention within the industry, positioning him as a valuable contributor to modern technological solutions.

Collaborations

Throughout his career, Salehi has collaborated with esteemed colleagues such as Michael Nathaniel Rosenblatt and Dennis R Pyper. These partnerships highlight the collaborative nature of innovation in technology, as they work together to advance the state of circuit board design and manufacturing.

Conclusion

Amir Salehi's contributions to the field of technology through his patents are a testament to his innovative mindset and dedication. His work in enhancing printed circuit board packages and system-in-a-package modules showcases the importance of innovation in the ever-evolving landscape of electrical devices. As technology continues to advance, the influence of inventors like Salehi remains crucial for future developments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…