The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Jun. 04, 2012
Applicants:

James H. Foster, Palo Alto, CA (US);

James W. Bilanski, Palo Alto, CA (US);

Amir Salehi, San Jose, CA (US);

Ramamurthy Chandhrasekhar, Cupertino, CA (US);

Nicholas Unger Webb, Menlo Park, CA (US);

Inventors:

James H. Foster, Palo Alto, CA (US);

James W. Bilanski, Palo Alto, CA (US);

Amir Salehi, San Jose, CA (US);

Ramamurthy Chandhrasekhar, Cupertino, CA (US);

Nicholas Unger Webb, Menlo Park, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H01L 23/552 (2013.01); H05K 9/003 (2013.01); H05K 9/0026 (2013.01); H05K 9/0043 (2013.01); H01L 25/0655 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 9/0033 (2013.01); H05K 9/0037 (2013.01); Y10T 29/49004 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49146 (2015.01);
Abstract

Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.


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