The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Nov. 05, 2012
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Gloria Lin, San Francisco, CA (US);

William Bryson Gardner, Jr., San Francisco, CA (US);

Joseph Fisher, Jr., San Jose, CA (US);

Dennis Pyper, San Jose, CA (US);

Amir Salehi, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01R 43/00 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/145 (2013.01); H05K 1/141 (2013.01); H05K 1/115 (2013.01); H05K 3/222 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09627 (2013.01); H05K 2201/10446 (2013.01);
Abstract

This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.


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