logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10991659 B1

PDFFull Text
Date of Patent:
Apr. 27, 2021

Filed:

Dec. 05, 2019

Substrate-less integrated components

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Flynn P. Carson, Redwood City, CA (US);

Jun Chung Hsu, Cupertino, CA (US);

Meng Chi Lee, Los Altos, CA (US);

Shatki S. Chauhan, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:

Jaffery Watson Mendonsa & Hamilton LLP

Primary Examiner:

Syed I Gheyas

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/78 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/485 (2013.01); H01L 21/4825 (2013.01); H01L 21/4853 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/28 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 24/14 (2013.01); H01L 21/568 (2013.01); H01L 24/92 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81005 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01);
Abstract

Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.

Find Patent Forward Citations

Loading…