Cupertino, CA, United States of America

Jun Chung Hsu

USPTO Granted Patents = 13 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 36(Granted Patents)


Location History:

  • Taoyuan, TW (2017 - 2023)
  • Cupertino, CA (US) (2016 - 2024)

Company Filing History:


Years Active: 2016-2025

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13 patents (USPTO):

Title: Inventor Spotlight: Jun Chung Hsu from Cupertino, CA

Introduction: Jun Chung Hsu is a prominent inventor based in Cupertino, California, known for his significant contributions to semiconductor packaging technologies. With a total of 13 patents to his name, Hsu has developed innovative solutions that have advanced the field of System on Chip (SoC) package substrates.

Latest Patents: Among Hsu's latest patents is the "Asymmetric Stackup Structure for SoC package substrates." This invention discloses an asymmetric stackup structure that allows for a more efficient design of an SoC package substrate. The design involves a substrate with multiple insulating material layers, featuring a recess that houses an integrated passive device. This structure is further enhanced by build-up layers and via paths to connect contacts between the upper and lower surfaces.

Another notable patent involves "Semiconductor packaging substrate fine pitch metal bump and reinforcement structures." This invention describes a packaging substrate with a build-up structure and a patterned metal contact layer that includes arrangements of surface mount metal bumps. This innovative approach is designed to improve chip mounting and overall substrate performance.

Career Highlights: Jun Chung Hsu has established an impressive career within the technological realm at Apple Inc. His work focuses on semiconductor advancements, where his contributions drive improvements in device performance and efficiency. Hsu's inventive spirit and expertise play a crucial role in benefiting the tech community, especially in the semiconductor industry.

Collaborations: Throughout his career, Hsu has collaborated with talented colleagues such as Flynn P. Carson and Meng Chi Lee, contributing to a synergy of ideas and innovative solutions in their projects at Apple Inc. These collaborations have produced groundbreaking advancements in technology, significantly impacting the semiconductor landscape.

Conclusion: Jun Chung Hsu continues to be a significant figure in the field of semiconductor packaging, with a proven track record of innovation reflected in his numerous patents. His contributions are paving the way for future advancements in technology, making him an inventor to watch as he progresses in his career at Apple Inc.

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