The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Nov. 06, 2015
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Assignee:
APPLE INC., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 23/49822 (2013.01); H01L 23/552 (2013.01); H01L 24/97 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01); H05K 3/4682 (2013.01); Y10T 29/49156 (2015.01);
Abstract
Method of forming ultra thin coreless substrates are described. In an embodiment, the method utilizes a debond layer including high and low adhesion surface areas to the carrier substrate, and cutting through the low adhesion surface areas to remove a build-up structure from the carrier substrate. An electrical short layer may be formed as a part of or on the debond layer to facilitate electrical testing of the build-up structure prior to debonding, and aid in the formation a 'known good' substrate on a support substrate.