Apple Inc.

Xilinx, Inc.

Stats Chippac Pte. Ltd.

Lsi Logic Corporation

National Semiconductor Corporation

Utac - United Test and Assembly Test Center Ltd.

Lan H Hoang

David M Kindlon

Chang Liu

Takayoshi Katahira

Leilei Zhang

Meng Chi Lee

Pandi Chelvam Marimuthu

HeeJo Chi

Daniel D Sunshine

Christopher Schultz

YoungChul Kim

Michael B Nussbaum

Andrew L Rosenberg

Kishore N Renjan

Manoj Vadeentavida

Bilal Mohamed Ibrahim Kani

Mark J Beesley

KyungMoon Kim

Andrew Sterian

JaeHak Yee

Steve Anderson

Breton M Saunders

Peter W Mash

KooHong Lee

David A Bolt

Paul Ying-Fung Wu

Raghunandan Chaware

Steven J Keating

Yanfeng Chen

Shankar S Pennathur

Kyusang Kim

Mandar Painaik

HunTeak Lee

Dennis R Pyper

Benjamin J Grena

Ali N Ergun

Wyeman Chen

Steven P Cardinali

Amir Salehi

Scott D Morrison

Siddharth Nangia

See Chian Lim

Hoa Lap Do

Vu Thanh Vo

Abu K Eghan

Laurene Yip

Anthony Yi-Sheng Sun

Rahul Kapoor

Desmond Yok Rue Chong

Kim Yong Goh

Jing Tao

Maryam Rahimi

Jason P Marsh

Yashar Abdollahian

Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.

Technologies for increased volumetric and functional efficiencies of optical packages

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

Sidewall connections and button interconnects for molded SiPs

Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

Built-in connector for board-to-board and flex-to-rigid board connection

Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

Flex board and flexible module

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Selective soldering with photonic soldering technology

Right angle sidewall and button interconnects for molded SiPs

Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

System in package for lower z height and reworkable component assembly

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Electrical components attached to fabric

System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

System-in-package including opposing circuit boards

Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.

Interconnect frames for SIP modules

Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

Low-profile space-efficient shielding for SIP module

Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

Vertical module and perpendicular pin array interconnect for stacked circuit board structure

Growing community of inventors

San Jose, CA, United States of America

Lan H Hoang