The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Dec. 13, 2012
Applicant:
Nvidia Corporation, Santa Clara, CA (US);
Inventors:
Shantanu Kalchuri, San Jose, CA (US);
Abraham F. Yee, Cupertino, CA (US);
Leilei Zhang, Sunnyvale, CA (US);
Assignee:
NVIDIA Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01); H01L 25/16 (2006.01); H01L 23/50 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/36 (2013.01); H01L 23/50 (2013.01); H01L 25/16 (2013.01); H01L 23/64 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01);
Abstract
An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip are at least partially disposed in the cavity or opening. Because the passive components are disposed in the cavity or opening, the integrated circuit system has a reduced package thickness.