Abraham Fong Yee

This inventor holds 36 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Packaging. Top assignees: Lsi Logic Corporation, Nvidia Corporation. Active years: 1993-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Abraham Fong Yee. Retrieved from https://idiyas.com/inventor/abraham-fong-yee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 36 (Patent Applications = 10)

% Patents Active = 97.2

Average Co-Inventor Count = 2.2

ph-index = 9

Forward Citations = 416(Granted Patents)

Location History:

Santa Clara, CA (US) (1993 - 1998)
Cupertino, CA (US) (1996 - 2019)

Company Filing History:

21 out of 3,715

Lsi Logic Corporation

Years Active: 1993-2019

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Areas of Expertise:

Printed Circuit Board

Microvias

Package-on-Package

Thermal Performance

Decoupling Capacitors

CMOS Devices

Interconnect Layers

Stiffener Ring

Superconductive Lines

Integrated Circuit

Field Oxidation

Programmable Gate Array

36 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10219387 - Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate (2019-02-26),

2. 10096534 - Thermal performance of logic chip in a package-on-package structure (2018-10-09),

3. 10032692 - Semiconductor package structure (2018-07-24),

4. 9831184 - Buried TSVs used for decaps (2017-11-28),

5. 9760132 - Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad (2017-09-12),

6. 9728481 - System with a high power chip and a low power chip having low interconnect parasitics (2017-08-08),

7. 9716051 - Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity (2017-07-25),

8. 9659815 - System, method, and computer program product for a cavity package-on-package structure (2017-05-23),

9. 9570284 - Method and system for controlling a semiconductor fabrication process (2017-02-14),

10. 9530714 - Low-profile chip package with modified heat spreader (2016-12-27),

11. 9379202 - Decoupling capacitors for interposers (2016-06-28),

12. 9368422 - Absorbing excess under-fill flow with a solder trench (2016-06-14),

13. 9087830 - System, method, and computer program product for affixing a post to a substrate pad (2015-07-21),

14. 8618651 - Buried TSVs used for decaps (2013-12-31),

15. 7964422 - Method and system for controlling a semiconductor fabrication process (2011-06-21),

Title: The Inventor Abraham Fong Yee

Introduction: Abraham Fong Yee is a renowned inventor based in Cupertino, CA (US) known for his groundbreaking innovations in various fields.

Latest Patents: Abraham Fong Yee holds several patents in the areas of technology, healthcare, and consumer electronics, showcasing his diverse range of expertise.

Career Highlights: With a career spanning over two decades, Abraham Fong Yee has consistently pushed the boundaries of innovation, leading to significant advancements in the industry.

Collaborations: Throughout his career, Abraham Fong Yee has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life and make a lasting impact on society.

Conclusion: Abraham Fong Yee's passion for innovation and his dedication to creating meaningful solutions have solidified his reputation as a pioneering inventor in the field.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

10 patents pending: