Integrated circuit package with a conductive grid formed in a packaging substrate

Abstract

An integrated circuit package includes a packaging substrate, which has an electrically conductive grid formed on a dielectric layer, and an integrated circuit die electrically coupled to the electrically conductive grid at one or more locations. In this embodiment, the electrically conductive grid includes a plurality of electrically conductive portions, wherein each portion is electrically coupled to at least one other portion, and a plurality of void regions that are electrically non-contiguous and substantially free of electrically conductive material. One advantage of the integrated circuit package is that a packaging substrate that is reduced in thickness, and therefore rigidity, can still maintain planarity during operation. The electrically conductive grid formed on a dielectric layer in the packaging substrate can replace a power plane or a ground plane in the packaging substrate, thereby reducing stressed produced as a result of thermal expansion mismatch between materials in the packaging substrate.