Lee John Smith

Title: Spotlight on Innovator Lee John Smith: Pioneering Patents for High Density Memory Card and Semiconductor Packaging

Introduction:

Lee John Smith, an accomplished inventor hailing from Chandler, AZ, has made significant contributions to the field of technology with his pioneering patents. With an impressive portfolio of 10 patents to his name, Smith's innovative solutions have revolutionized the memory card industry and improved semiconductor packaging techniques. This article delves into his latest patents and highlights some of the noteworthy companies he has been associated with during his illustrious career.

Memory Card Innovation: High Density Memory Card using Folded Flex

Smith's groundbreaking patent for a high-density memory card using folded flex technology has garnered widespread attention. This memory card design utilizes a flexible substrate, or "flex," that is integrated within the card and folded in a prescribed manner. The flex houses various active and passive devices, such as a controller and memory components, which are surface-mounted to a common side. These devices are electrically connected to a conductive pattern on the flex, which is further linked to external signal contacts. By leveraging folded flex technology, Smith's invention significantly enhances the memory card's capacity, enabling support for four or more standard, pre-packaged memory devices.

Semiconductor Packaging Breakthrough: Shielding for a Semiconductor Package

Another notable patent by Smith revolves around innovative shielding techniques for semiconductor packaging. In this invention, a semiconductor device comprises a substrate and a first die electrically attached to its surface. To ensure reliable performance, a shield spacer with two surfaces is utilized, attaching the second surface to the first die's surface. Multiple wirebonds are then connected to the shield spacer and the substrate. Finally, a mold compound encapsulates the first die, shield spacer, and wirebonds, providing optimal protection and shielding for the semiconductor package.

Professional Experience: Companies and Collaborations

Smith's contributions are not limited to patents alone; his expertise and innovative mindset have led him to work with reputable organizations in the technology industry. He has held positions at prominent companies such as Amkor Technology, Inc. and Tessera, Inc. (formerly known as Intellect Electronics Corporation). These collaborations have provided valuable platforms for Smith to apply his inventive skills and contribute to cutting-edge advancements in the industry.

Collaborators: Sukianto Rusli and Bob Shih-Wei Kuo

Throughout his prolific career, Smith has had the privilege of working alongside brilliant minds and accomplished professionals. Noteworthy among his collaborators are Sukianto Rusli and Bob Shih-Wei Kuo, individuals whose expertise and skills have complemented Smith's own innovative pursuits. The synergy created through these collaborations has undoubtedly played a vital role in the successful development of pioneering inventions and patents.

Conclusion:

Lee John Smith's contributions to the field of innovations and patents have left an indelible mark on the technology industry. His groundbreaking patents for a high-density memory card using folded flex and advanced shielding techniques for semiconductor packaging demonstrate his ability to drive innovation and push boundaries. Smith's association with renowned companies and collaborations with talented individuals further enrich his journey as an esteemed inventor. As the technology landscape continues to evolve, innovators like Smith provide the necessary impetus for progress and inspire future generations to embrace the possibilities of innovation and invention.