The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Dec. 10, 2007
Ronald Patrick Huemoeller, Chandler, AZ (US);
Sukianto Rusli, Phoenix, AZ (US);
Bob Shih-wei Kuo, Chandler, AZ (US);
Jon Gregory Aday, Chandler, AZ (US);
Lee John Smith, Chandler, AZ (US);
Robert F. Darveaux, Higley, AZ (US);
Ronald Patrick Huemoeller, Chandler, AZ (US);
Sukianto Rusli, Phoenix, AZ (US);
Bob Shih-Wei Kuo, Chandler, AZ (US);
Jon Gregory Aday, Chandler, AZ (US);
Lee John Smith, Chandler, AZ (US);
Robert F. Darveaux, Higley, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and a buildup dielectric material is mounted to the dielectric material and the circuit pattern. Laser-ablated artifacts are formed in the buildup dielectric material and filled with an electrically conductive material to form a buildup circuit pattern. The second carrier is patterned into a stiffener, which provides rigidity to the thin package.