This inventor holds 4 USPTO granted patents. Top assignees: Amkor Technology, Inc., Cts Corporation. Active years: 1999-2011.
Location History:
- Gilbert, AZ (US) (1999 - 2002)
- Chandler, AZ (US) (2011)
Company Filing History:
Years Active: 1999-2011
Title: Innovations of Jon G Aday
Introduction
Jon G Aday is an accomplished inventor based in Gilbert, AZ (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative approaches have paved the way for advancements in thin substrate fabrication methods and semiconductor module packaging.
Latest Patents
One of Jon G Aday's latest patents is the "Thin substrate fabrication method and structure." This method involves forming a circuit pattern on a first carrier and embedding it in a dielectric material on a second carrier. The first carrier is then removed, and a buildup dielectric material is mounted to the dielectric material and the circuit pattern. Laser-ablated artifacts are created in the buildup dielectric material and filled with an electrically conductive material to establish a buildup circuit pattern. The second carrier is patterned into a stiffener, providing rigidity to the thin package.
Another notable patent is the "Semiconductor module package substrate fabrication method." In this process, an organic solderability protectant (OSP) is applied to copper bond pads, which include flip chip bond pads and SMD bond pads on a dielectric upper surface, as well as BGA bond pads on a dielectric lower surface. Solder paste is applied to the flip chip bond pads and reflowed in an inert atmosphere to create solder-on-pads (SOPs). The flux residue from the solder paste is subsequently removed with water, inhibiting degradation of the OSP and oxidation of the SMD and BGA bond pads.
Career Highlights
Throughout his career, Jon G Aday has worked with prominent companies such as Amkor Technology, Inc. and CTS Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and packaging solutions.
Collaborations
Jon has collaborated with notable professionals in the field, including Christopher Marc Scanlan and Jeffrey Eanes Christensen. These partnerships have further enhanced his innovative capabilities and contributions to the industry.
Conclusion
Jon G Aday's work exemplifies the spirit of innovation in semiconductor packaging. His patents and career achievements reflect his dedication to advancing technology in this critical field.