Amkor Technology, Inc.

Cts Corporation

Jon G Aday

Christopher Marc Scanlan

Ronald Patrick Huemoeller

Robert Francis Darveaux

Sukianto Rusli

Bob Shih-Wei Kuo

Gary Carl Johnson

Lee John Smith

Michael J Anderson

Jeffrey Eanes Christensen

Gregory Kennison

A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and a buildup dielectric material is mounted to the dielectric material and the circuit pattern. Laser-ablated artifacts are formed in the buildup dielectric material and filled with an electrically conductive material to form a buildup circuit pattern. The second carrier is patterned into a stiffener, which provides rigidity to the thin package.

Thin substrate fabrication method and structure

Organic solderability protectant (OSP) is applied to copper bond pads. The copper bond pads include flip chip bond pads and SMD bond pads on a dielectric upper surface and BGA bond pads on a dielectric lower surface. Solder paste is applied to the flip chip bond pads. This solder paste is reflowed in an inert atmosphere to form solder-on-pads (SOPs) on the flip chip bond pads. Flux residue from the solder paste is then removed with water. By reflowing the solder paste in an inert atmosphere and removing the flux residue with water, degradation of the OSP and oxidation of the SMD and BGA bond pads is inhibited.

Semiconductor module package substrate fabrication method

A substrate includes a flip chip bond pad and a first bond pad on a dielectric substrate layer. First and second organic solderability protectant (OSP) layers are on the flip chip bond and first bond pad, respectively. A solder paste is on the first OSP layer. The solder paste is reflowed in an inert atmosphere to form a solder-on-pad (SOP) directly on and in contact with the flip chip bond pad. A sufficient thickness of the second OSP layer remains after reflow to inhibit oxidation of the first bond pad.

Semiconductor module package substrate

A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.

Surface acoustic wave device package and method

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Gilbert, AZ, United States of America

Jon G Aday