The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Dec. 03, 2008
Roger D. St. Amand, Tempe, AZ (US);
Nozad O. Karim, Chandler, AZ (US);
Joseph M. Longo, Holly Springs, NC (US);
Lee J. Smith, Chandler, AZ (US);
Robert F. Darveaux, Gilbert, AZ (US);
Jong OK Chun, Chandler, AZ (US);
Jingkun Mao, Maricopa, AZ (US);
Roger D. St. Amand, Tempe, AZ (US);
Nozad O. Karim, Chandler, AZ (US);
Joseph M. Longo, Holly Springs, NC (US);
Lee J. Smith, Chandler, AZ (US);
Robert F. Darveaux, Gilbert, AZ (US);
Jong Ok Chun, Chandler, AZ (US);
Jingkun Mao, Maricopa, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.